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Real time investigation of conduction mechanism with bias stress in silica-based intermetal dielectrics
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Authors
Li, Yunlong
;
Groeseneken, Guido
;
Maex, Karen
;
Tokei, Zsolt
Issue
2
Journal
IEEE Trans. Device and Materials Reliability
Volume
7
Title
Real time investigation of conduction mechanism with bias stress in silica-based intermetal dielectrics
Publication type
Journal article
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