Publication:
Real time investigation of conduction mechanism with bias stress in silica-based intermetal dielectrics
Date
| dc.contributor.author | Li, Yunlong | |
| dc.contributor.author | Groeseneken, Guido | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.author | Tokei, Zsolt | |
| dc.contributor.imecauthor | Li, Yunlong | |
| dc.contributor.imecauthor | Groeseneken, Guido | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.contributor.imecauthor | Tokei, Zsolt | |
| dc.contributor.orcidimec | Li, Yunlong::0000-0003-4791-4013 | |
| dc.date.accessioned | 2021-10-16T17:28:22Z | |
| dc.date.available | 2021-10-16T17:28:22Z | |
| dc.date.issued | 2007 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/12479 | |
| dc.source.beginpage | 252 | |
| dc.source.endpage | 258 | |
| dc.source.issue | 2 | |
| dc.source.journal | IEEE Trans. Device and Materials Reliability | |
| dc.source.volume | 7 | |
| dc.title | Real time investigation of conduction mechanism with bias stress in silica-based intermetal dielectrics | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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