dc.contributor.author | Limaye, Paresh | |
dc.contributor.author | Labie, Riet | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Vandepitte, Dirk | |
dc.contributor.author | Verlinden, Bert | |
dc.date.accessioned | 2021-10-16T17:32:35Z | |
dc.date.available | 2021-10-16T17:32:35Z | |
dc.date.issued | 2007 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/12493 | |
dc.source | IIOimport | |
dc.title | Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Labie, Riet | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.source.peerreview | no | |
dc.source.beginpage | 703 | |
dc.source.endpage | 712 | |
dc.source.conference | 9th Electronics Packaging Technology Conference - EPTC | |
dc.source.conferencedate | 10/12/2007 | |
dc.source.conferencelocation | Singapore | |
imec.availability | Published - imec | |