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High performance 3D : a cost benefit analysis

dc.contributor.authorList, Scott
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T17:34:39Z
dc.date.available2021-10-16T17:34:39Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12500
dc.sourceIIOimport
dc.titleHigh performance 3D : a cost benefit analysis
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceSEMI Technical Symposium: Innovations in Semiconductor Manufacturing
dc.source.conferencedate31/01/2007
dc.source.conferencelocationSeoul Korea
imec.availabilityPublished - open access


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