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Leveling of microvias for wafer level packaging

dc.contributor.authorLuhn, Ole
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorBaert, Kris
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-16T17:41:15Z
dc.date.available2021-10-16T17:41:15Z
dc.date.issued2007-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12523
dc.sourceIIOimport
dc.titleLeveling of microvias for wafer level packaging
dc.typeProceedings paper
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage123
dc.source.endpage133
dc.source.conferenceElectrochemical Processing in ULSI and MEMS 3
dc.source.conferencedate6/05/2007
dc.source.conferencelocationChicago, IL USA
imec.availabilityPublished - open access
imec.internalnotesECS Trans.; Vol. 6; Issue 8


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