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Microvia-filling by copper electroplating

dc.contributor.authorLuhn, Ole
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.date.accessioned2021-10-16T17:41:31Z
dc.date.available2021-10-16T17:41:31Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12524
dc.sourceIIOimport
dc.titleMicrovia-filling by copper electroplating
dc.typeOral presentation
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.source.peerreviewno
dc.source.conferenceEurointerfinish
dc.source.conferencedate18/10/2007
dc.source.conferencelocationAthens Greece
imec.availabilityPublished - imec


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