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Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

dc.contributor.authorOechsner, Richard
dc.contributor.authorPfeffer, M.
dc.contributor.authorFrickinger, J.
dc.contributor.authorSchellenberger, M.
dc.contributor.authorRoeder, G.
dc.contributor.authorPfitzner, L.
dc.contributor.authorRyssel, H.
dc.contributor.authorFritzsche, M.
dc.contributor.authorKaushik, V.
dc.contributor.authorRenaud, D.
dc.contributor.authorDanel, A.
dc.contributor.authorClaeys, Cor
dc.contributor.authorBearda, Twan
dc.contributor.authorLering, M.
dc.contributor.authorGraef, M.
dc.contributor.authorMurphy, B.
dc.contributor.authorWalther, H.
dc.contributor.authorHury, S.
dc.date.accessioned2021-10-16T18:14:50Z
dc.date.available2021-10-16T18:14:50Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12632
dc.sourceIIOimport
dc.titleApproach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites
dc.typeJournal article
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage215
dc.source.endpage221
dc.source.journalIEEE Trans. Semiconductor Manufacturing
dc.source.issue3
dc.source.volume20
imec.availabilityPublished - open access


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