Authors

Oechsner, Richard; Pfeffer, M.; Frickinger, J.; Schellenberger, M.; Roeder, G.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.; Kaushik, V.; Renaud, D.; Danel, A.; Claeys, Cor; Bearda, Twan; Lering, M.; Graef, M.; Murphy, B.; Walther, H.; Hury, S.

Issue

3

Journal

IEEE Trans. Semiconductor Manufacturing

Volume

20

Title

Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

Publication type

Journal article

Embargo date

9999-12-31