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Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

Date

2007
Journal article
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dc.contributor.authorOechsner, Richard
dc.contributor.authorPfeffer, M.
dc.contributor.authorFrickinger, J.
dc.contributor.authorSchellenberger, M.
dc.contributor.authorRoeder, G.
dc.contributor.authorPfitzner, L.
dc.contributor.authorRyssel, H.
dc.contributor.authorFritzsche, M.
dc.contributor.authorKaushik, V.
dc.contributor.authorRenaud, D.
dc.contributor.authorDanel, A.
dc.contributor.authorClaeys, Cor
dc.contributor.authorBearda, Twan
dc.contributor.authorLering, M.
dc.contributor.authorGraef, M.
dc.contributor.authorMurphy, B.
dc.contributor.authorWalther, H.
dc.contributor.authorHury, S.
dc.date.accessioned2021-10-16T18:14:50Z
dc.date.available2021-10-16T18:14:50Z
dc.date.embargo9999-12-31
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12632
dc.source.beginpage215
dc.source.endpage221
dc.source.issue3
dc.source.journalIEEE Trans. Semiconductor Manufacturing
dc.source.volume20
dc.title

Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

dc.typeJournal article
dspace.entity.typePublication
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