Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

Oechsner, Richard; Pfeffer, M.; Frickinger, J.; Schellenberger, M.; Roeder, G.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.; Kaushik, V.; Renaud, D.; Danel, A.; Claeys, Cor; Bearda, Twan; Lering, M.; Graef, M.; Murphy, B.; Walther, H.; Hury, S.

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Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

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2007

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IEEE Trans. Semiconductor Manufacturing

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Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

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