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3D-stacking for image sensor applications

dc.contributor.authorPieters, Philip
dc.contributor.authorDe Munck, Koen
dc.contributor.authorBogaerts, Jan
dc.date.accessioned2021-10-16T18:38:09Z
dc.date.available2021-10-16T18:38:09Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12705
dc.sourceIIOimport
dc.title3D-stacking for image sensor applications
dc.typeProceedings paper
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorDe Munck, Koen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage123
dc.source.endpage124
dc.source.conference12th International Commercialisation of Micro and Nano Systems Conference - COMS
dc.source.conferencedate2/09/2007
dc.source.conferencelocationMelbourne Australia
imec.availabilityPublished - open access


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