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Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias

dc.contributor.authorPosada Quijano, Guillermo
dc.contributor.authorCarchon, Geert
dc.contributor.authorSoussan, Philippe
dc.contributor.authorPham, Nga
dc.contributor.authorMajeed, Bivragh
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorDe Raedt, Walter
dc.date.accessioned2021-10-16T18:46:50Z
dc.date.available2021-10-16T18:46:50Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12733
dc.sourceIIOimport
dc.titleMicrostrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias
dc.typeProceedings paper
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecMajeed, Bivragh::0000-0002-1535-4544
dc.source.peerreviewyes
dc.source.beginpage335
dc.source.endpage338
dc.source.conferenceEuropean Microwave Integrated Circuit Conference - EuMIC
dc.source.conferencedate8/10/2007
dc.source.conferencelocationMünchen Germany
imec.availabilityPublished - imec


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