dc.contributor.author | Posada Quijano, Guillermo | |
dc.contributor.author | Carchon, Geert | |
dc.contributor.author | Soussan, Philippe | |
dc.contributor.author | Pham, Nga | |
dc.contributor.author | Majeed, Bivragh | |
dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
dc.contributor.author | Ruythooren, Wouter | |
dc.contributor.author | Nauwelaers, Bart | |
dc.contributor.author | De Raedt, Walter | |
dc.date.accessioned | 2021-10-16T18:46:50Z | |
dc.date.available | 2021-10-16T18:46:50Z | |
dc.date.issued | 2007 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/12733 | |
dc.source | IIOimport | |
dc.title | Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Soussan, Philippe | |
dc.contributor.imecauthor | Pham, Nga | |
dc.contributor.imecauthor | Majeed, Bivragh | |
dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
dc.contributor.imecauthor | Ruythooren, Wouter | |
dc.contributor.imecauthor | Nauwelaers, Bart | |
dc.contributor.imecauthor | De Raedt, Walter | |
dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
dc.contributor.orcidimec | De Raedt, Walter::0000-0002-7117-7976 | |
dc.contributor.orcidimec | Majeed, Bivragh::0000-0002-1535-4544 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 335 | |
dc.source.endpage | 338 | |
dc.source.conference | European Microwave Integrated Circuit Conference - EuMIC | |
dc.source.conferencedate | 8/10/2007 | |
dc.source.conferencelocation | München Germany | |
imec.availability | Published - imec | |