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Microstrip thin-film MCM-D technology as enabling platform for the integration of high-performance SiP modules

dc.contributor.authorPosada Quijano, Guillermo
dc.contributor.authorCarchon, Geert
dc.contributor.authorSoussan, Philippe
dc.contributor.authorPham, Nga
dc.contributor.authorMajeed, Bivragh
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T18:47:13Z
dc.date.available2021-10-16T18:47:13Z
dc.date.issued2007-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12734
dc.sourceIIOimport
dc.titleMicrostrip thin-film MCM-D technology as enabling platform for the integration of high-performance SiP modules
dc.typeMeeting abstract
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIMAPS Advanced Technology Workshop on Integrated/Embedded Passives
dc.source.conferencedate15/11/2007
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


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