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Sidewall damage in silica-based low-k material induced by different patterning plasma processes studied by energy filtered and analytical scanning TEM

dc.contributor.authorRichard, Olivier
dc.contributor.authorIacopi, Francesca
dc.contributor.authorBender, Hugo
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-16T19:01:19Z
dc.date.available2021-10-16T19:01:19Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12776
dc.sourceIIOimport
dc.titleSidewall damage in silica-based low-k material induced by different patterning plasma processes studied by energy filtered and analytical scanning TEM
dc.typeJournal article
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.source.peerreviewno
dc.source.beginpage517
dc.source.endpage523
dc.source.journalMicroelectronic Engineering
dc.source.issue3
dc.source.volume84
imec.availabilityPublished - imec


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