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TDDB reliability prediction based on the statistical analysis of hard break-down including multiple soft breakdown and wear out
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Authors
Sahhaf, Sahar
;
Degraeve, Robin
;
Roussel, Philippe
;
Kauerauf, Thomas
;
Kaczer, Ben
;
Groeseneken, Guido
Conference
Technical Digest International Electron Devices Meeting - IEDM
Title
TDDB reliability prediction based on the statistical analysis of hard break-down including multiple soft breakdown and wear out
Publication type
Proceedings paper
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