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Surface properties restoration and passivation of high porosity ultra low-k dielectric (k~2.3) after direct-CMP

dc.contributor.authorSinapi, Fabrice
dc.contributor.authorHeylen, Nancy
dc.contributor.authorTravaly, Youssef
dc.contributor.authorVereecke, Guy
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorKesters, Els
dc.contributor.authorVan Hoeymissen, Jan
dc.contributor.authorHernandez, Jose Luis
dc.contributor.authorBeyer, Gerald
dc.contributor.authorFisher, P.
dc.date.accessioned2021-10-16T19:48:21Z
dc.date.available2021-10-16T19:48:21Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12912
dc.sourceIIOimport
dc.titleSurface properties restoration and passivation of high porosity ultra low-k dielectric (k~2.3) after direct-CMP
dc.typeJournal article
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorHernandez, Jose Luis
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewno
dc.source.beginpage2620
dc.source.endpage2623
dc.source.journalMicroelectronic Engineering
dc.source.issue11
dc.source.volume84
imec.availabilityPublished - imec
imec.internalnotesPaper from MAM Workshop


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