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Copper-nail TSV technology for 3D-stacked IC integration

dc.contributor.authorSnoeckx, Koen
dc.contributor.authorBeyne, Eric
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-16T19:53:00Z
dc.date.available2021-10-16T19:53:00Z
dc.date.issued2007-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12925
dc.sourceIIOimport
dc.titleCopper-nail TSV technology for 3D-stacked IC integration
dc.typeJournal article
dc.contributor.imecauthorSnoeckx, Koen
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage53
dc.source.endpage55
dc.source.journalSolid State Technology
dc.source.issue5
dc.source.volume50
imec.availabilityPublished - imec


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