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Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment

dc.contributor.authorUrbanowicz, Adam
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorHeijlen, Jeroen
dc.contributor.authorTravaly, Youssef
dc.contributor.authorCockburn, Andrew
dc.date.accessioned2021-10-16T20:21:51Z
dc.date.available2021-10-16T20:21:51Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13005
dc.sourceIIOimport
dc.titleDamage reduction and sealing of low-k films by combined He and NH3 plasma treatment
dc.typeJournal article
dc.contributor.imecauthorHeijlen, Jeroen
dc.contributor.imecauthorCockburn, Andrew
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpageG76
dc.source.endpageG79
dc.source.journalElectrochemical and Solid-State Letters
dc.source.issue10
dc.source.volume10
imec.availabilityPublished - open access


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