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Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections

dc.contributor.authorVan Erps, J.
dc.contributor.authorHendrickx, Nina
dc.contributor.authorDebaes, C.
dc.contributor.authorVan Daele, Peter
dc.contributor.authorThienpont, H.
dc.date.accessioned2021-10-16T20:38:21Z
dc.date.available2021-10-16T20:38:21Z
dc.date.issued2007-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13051
dc.sourceIIOimport
dc.titlePrototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections
dc.typeProceedings paper
dc.contributor.imecauthorVan Daele, Peter
dc.contributor.orcidimecVan Daele, Peter::0000-0003-0557-7741
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage70
dc.source.endpage75
dc.source.conferenceIMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference - EMPC
dc.source.conferencedate17/06/2007
dc.source.conferencelocationOulu Finland
imec.availabilityPublished - open access
imec.internalnotesISBN 978-952-99751-1-2 (paper back) or 78-952-99751-2-9 (CD-ROM)


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