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Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

dc.contributor.authorVan Steenberge, Nele
dc.contributor.authorLimaye, Paresh
dc.contributor.authorWillems, Geert
dc.contributor.authorVandevelde, Bart
dc.contributor.authorSchildermans, Inge
dc.date.accessioned2021-10-16T20:55:55Z
dc.date.available2021-10-16T20:55:55Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13100
dc.sourceIIOimport
dc.titleAnalytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
dc.typeJournal article
dc.contributor.imecauthorWillems, Geert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.beginpage215
dc.source.endpage222
dc.source.journalMicroelectronics Reliability
dc.source.issue2_3
dc.source.volume47
imec.availabilityPublished - imec


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