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Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
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Authors
Van Steenberge, Nele
;
Limaye, Paresh
;
Willems, Geert
;
Vandevelde, Bart
;
Schildermans, Inge
Issue
2_3
Journal
Microelectronics Reliability
Volume
47
Title
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
Publication type
Journal article
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