Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

dc.contributor.author	Van Steenberge, Nele
dc.contributor.author	Limaye, Paresh
dc.contributor.author	Willems, Geert
dc.contributor.author	Vandevelde, Bart
dc.contributor.author	Schildermans, Inge
dc.contributor.imecauthor	Willems, Geert
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.orcidimec	Willems, Geert::0000-0002-9137-618X
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.date.accessioned	2021-10-16T20:55:55Z
dc.date.available	2021-10-16T20:55:55Z
dc.date.issued	2007
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/13100
dc.source.beginpage	215
dc.source.endpage	222
dc.source.issue	2_3
dc.source.journal	Microelectronics Reliability
dc.source.volume	47
dc.title	Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
dc.type	Journal article
dspace.entity.type	Publication
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