dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Brebels, Steven | |
dc.contributor.author | Okoro, Chukwudi | |
dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Chen, L.C. | |
dc.contributor.author | Christiaens, W. | |
dc.contributor.author | Vanfleteren, Jan | |
dc.date.accessioned | 2021-10-16T21:06:30Z | |
dc.date.available | 2021-10-16T21:06:30Z | |
dc.date.issued | 2007 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13129 | |
dc.source | IIOimport | |
dc.title | Embedding of chips in flex: a global optimization from thermal, mechanical and electrical RF perspective | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Brebels, Steven | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Vanfleteren, Jan | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Brebels, Steven::0000-0002-1568-0286 | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
dc.source.peerreview | no | |
dc.source.beginpage | 25 | |
dc.source.endpage | 30 | |
dc.source.conference | Proceedings 16th European Microelectronics and Packaging Conference - EMPC | |
dc.source.conferencedate | 17/06/2007 | |
dc.source.conferencelocation | Oulu Finland | |
imec.availability | Published - imec | |