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Improvement of high temperature water rinsing and drying for HF-last wafer cleaning

dc.contributor.authorLi, Li
dc.contributor.authorBender, Hugo
dc.contributor.authorZou, Gang
dc.contributor.authorMertens, Paul
dc.contributor.authorMeuris, Marc
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-09-29T14:42:31Z
dc.date.available2021-09-29T14:42:31Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1322
dc.sourceIIOimport
dc.titleImprovement of high temperature water rinsing and drying for HF-last wafer cleaning
dc.typeJournal article
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage233
dc.source.endpage237
dc.source.journalJournal of the Electrochemical Society
dc.source.issue1
dc.source.volume143
imec.availabilityPublished - open access


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