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Effect of plasma treatments on the compatibility of ULK to wet cleaning

dc.contributor.authorXu, Kaidong
dc.contributor.authorKesters, Els
dc.contributor.authorVereecke, Guy
dc.contributor.authorLux, Marcel
dc.contributor.authorKraus, H
dc.contributor.authorHenry, S.A.
dc.contributor.authorArcher, L
dc.contributor.authorGaulhofer, E.
dc.contributor.authorKovacs, F.
dc.contributor.authorDalmer, M
dc.contributor.authorSchmidt, T
dc.contributor.authorLeunissen, Peter
dc.contributor.authorMertens, Paul
dc.contributor.authorLuo, S.J.
dc.contributor.authorHan, Q. Y.
dc.date.accessioned2021-10-16T21:48:51Z
dc.date.available2021-10-16T21:48:51Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13238
dc.sourceIIOimport
dc.titleEffect of plasma treatments on the compatibility of ULK to wet cleaning
dc.typeProceedings paper
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewno
dc.source.conferenceProceedings of the SEMI-ECS International Semiconductor Technology Conference - ISTC
dc.source.conferencedate18/03/2007
dc.source.conferencelocationShanghai China
imec.availabilityPublished - imec


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