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Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity

dc.contributor.authorZhang, Wenqi
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorLi, Zhen
dc.contributor.authorLi, dagang
dc.contributor.authorRichard, Olivier
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-16T21:59:12Z
dc.date.available2021-10-16T21:59:12Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13262
dc.sourceIIOimport
dc.titleAnalysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity
dc.typeJournal article
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage63703
dc.source.journalJournal of Applied Physics
dc.source.issue6
dc.source.volume101
imec.availabilityPublished - open access


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