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Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity
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Authors
Zhang, Wenqi
;
Brongersma, Sywert
;
Li, Zhen
;
Li, dagang
;
Richard, Olivier
;
Maex, Karen
Issue
6
Journal
Journal of Applied Physics
Volume
101
Title
Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity
Publication type
Journal article
Embargo date
9999-12-31
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