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Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity
Publication:
Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity
Date
2007
Journal article
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15426.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zhang, Wenqi
;
Brongersma, Sywert
;
Li, Zhen
;
Li, dagang
;
Richard, Olivier
;
Maex, Karen
Journal
Journal of Applied Physics
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1895
since deposited on 2021-10-16
Acq. date: 2025-10-23
Citations
Metrics
Views
1895
since deposited on 2021-10-16
Acq. date: 2025-10-23
Citations