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Materials engineering for future interconnects: "catalyst-free" electroless Cu deposition on self-assembly monolayer alternative barriers

dc.contributor.authorArmini, Silvia
dc.contributor.authorWhelan, Caroline
dc.date.accessioned2021-10-17T06:14:00Z
dc.date.available2021-10-17T06:14:00Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13312
dc.sourceIIOimport
dc.titleMaterials engineering for future interconnects: "catalyst-free" electroless Cu deposition on self-assembly monolayer alternative barriers
dc.typeMeeting abstract
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpage918
dc.source.conferenceInternational Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate23/09/2008
dc.source.conferencelocationTsukuba Japan
imec.availabilityPublished - imec


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