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Copper CMP with composite polymer core – silica shell abrasives: a defectivity study

dc.contributor.authorArmini, Silvia
dc.contributor.authorWhelan, Caroline
dc.contributor.authorMoinpour, Mansour
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-17T06:14:08Z
dc.date.available2021-10-17T06:14:08Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13316
dc.sourceIIOimport
dc.titleCopper CMP with composite polymer core – silica shell abrasives: a defectivity study
dc.typeMeeting abstract
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpageN11.4
dc.source.conferenceMaterials Research Society Spring Meeting Symposium N: Materials and Processes for Advanced Interconnects for Microelectronics
dc.source.conferencedate23/03/2008
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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