| dc.contributor.author | Beyne, Eric | |
| dc.date.accessioned | 2021-10-17T06:17:40Z | |
| dc.date.available | 2021-10-17T06:17:40Z | |
| dc.date.issued | 2008 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13381 | |
| dc.source | IIOimport | |
| dc.title | 3D system integration challenges and opportunities | |
| dc.type | Proceedings paper | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.source.peerreview | no | |
| dc.source.conference | IEEE Systems Packaging Japan Workshop "The Technology Vision of Electronics Packaging for the 2010's" | |
| dc.source.conferencedate | 28/01/2008 | |
| dc.source.conferencelocation | Hakone Japan | |
| imec.availability | Published - imec | |
