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Solving technical and cconomical barriers to the adoption of through-Si-via 3D integration technologies

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T06:18:01Z
dc.date.available2021-10-17T06:18:01Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13387
dc.sourceIIOimport
dc.titleSolving technical and cconomical barriers to the adoption of through-Si-via 3D integration technologies
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage29
dc.source.endpage34
dc.source.conference10th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate9/12/2008
dc.source.conferencelocationSingapore
imec.availabilityPublished - open access


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