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Through-silicon via and die stacking technologies for microsystems-integration

dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Moor, Piet
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorLabie, Riet
dc.contributor.authorJourdain, Anne
dc.contributor.authorTilmans, Harrie
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorSoussan, Philippe
dc.contributor.authorSwinnen, Bart
dc.contributor.authorCartuyvels, Rudi
dc.date.accessioned2021-10-17T06:18:09Z
dc.date.available2021-10-17T06:18:09Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13389
dc.sourceIIOimport
dc.titleThrough-silicon via and die stacking technologies for microsystems-integration
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorCartuyvels, Rudi
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage495
dc.source.endpage498
dc.source.conferenceTechnical Digest International Electron Devices Meeting - IEDM
dc.source.conferencedate15/12/2008
dc.source.conferencelocationSan Francisco, CA US
imec.availabilityPublished - open access


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