dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Jourdain, Anne | |
dc.date.accessioned | 2021-10-17T06:18:17Z | |
dc.date.available | 2021-10-17T06:18:17Z | |
dc.date.issued | 2008 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13391 | |
dc.source | IIOimport | |
dc.title | MEMS packaging using 3D-Si integration approaches | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Jourdain, Anne | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.conference | IMAPS-Benelux Autumn Event | |
dc.source.conferencedate | 20/11/2008 | |
dc.source.conferencelocation | Eindhoven The Nederlands | |
imec.availability | Published - imec | |