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System-in-a-package technology for 3D integration of radar modules

dc.contributor.authorBrebels, Steven
dc.contributor.authorSun, Xiao
dc.contributor.authorPosada Quijano, Guillermo
dc.contributor.authorDussopt, Laurent
dc.contributor.authorDubois, Marc-Alexandre
dc.contributor.authorVandenbosch, Guy
dc.contributor.authorDe Raedt, Walter
dc.date.accessioned2021-10-17T06:23:27Z
dc.date.available2021-10-17T06:23:27Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13449
dc.sourceIIOimport
dc.titleSystem-in-a-package technology for 3D integration of radar modules
dc.typeProceedings paper
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewyes
dc.source.conferenceMicrowaves, Radar and Remote Sensing - MRRS
dc.source.conferencedate22/09/2008
dc.source.conferencelocationKiev Ukraine
imec.availabilityPublished - imec


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