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RF packaging activities @ imec

dc.contributor.authorCarchon, Geert
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorSoussan, Philippe
dc.contributor.authorTilmans, Harrie
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T06:26:22Z
dc.date.available2021-10-17T06:26:22Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13475
dc.sourceIIOimport
dc.titleRF packaging activities @ imec
dc.typeOral presentation
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceOpportunities and Risks in Miniaturisation and Integration of Electronics
dc.source.conferencedate11/03/2008
dc.source.conferencelocationOulu Finland
imec.availabilityPublished - imec


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