dc.contributor.author | Christiaens, Wim | |
dc.contributor.author | Loeher, T. | |
dc.contributor.author | Pahl, B. | |
dc.contributor.author | Feil, M. | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Vanfleteren, Jan | |
dc.date.accessioned | 2021-10-17T06:32:33Z | |
dc.date.available | 2021-10-17T06:32:33Z | |
dc.date.issued | 2008 | |
dc.identifier.issn | 0305-6120 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13524 | |
dc.source | IIOimport | |
dc.title | Embedding and assembly of ultrathin chips in multilayer flex boards | |
dc.type | Journal article | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Vanfleteren, Jan | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 3 | |
dc.source.endpage | 8 | |
dc.source.journal | Circuit World | |
dc.source.issue | 3 | |
dc.source.volume | 34 | |
imec.availability | Published - open access | |