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Embedding and assembly of ultrathin chips in multilayer flex boards
Publication:
Embedding and assembly of ultrathin chips in multilayer flex boards
Date
2008
Journal article
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17338.pdf
1.05 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Christiaens, Wim
;
Loeher, T.
;
Pahl, B.
;
Feil, M.
;
Vandevelde, Bart
;
Vanfleteren, Jan
Journal
Circuit World
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1879
since deposited on 2021-10-17
Acq. date: 2025-10-25
Citations
Metrics
Views
1879
since deposited on 2021-10-17
Acq. date: 2025-10-25
Citations