Publication:

Embedding and assembly of ultrathin chips in multilayer flex boards

Date

2008
Journal article
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dc.contributor.authorChristiaens, Wim
dc.contributor.authorLoeher, T.
dc.contributor.authorPahl, B.
dc.contributor.authorFeil, M.
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-17T06:32:33Z
dc.date.available2021-10-17T06:32:33Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.issn0305-6120
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13524
dc.source.beginpage3
dc.source.endpage8
dc.source.issue3
dc.source.journalCircuit World
dc.source.volume34
dc.title

Embedding and assembly of ultrathin chips in multilayer flex boards

dc.typeJournal article
dspace.entity.typePublication
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