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Effects of plasma surface treatment on the self-forming barrier process in porous SiOCH

dc.contributor.authorChung, Seung-Min
dc.contributor.authorKoike, Junichi
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-17T06:32:48Z
dc.date.available2021-10-17T06:32:48Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13526
dc.sourceIIOimport
dc.titleEffects of plasma surface treatment on the self-forming barrier process in porous SiOCH
dc.typeProceedings paper
dc.contributor.imecauthorTokei, Zsolt
dc.source.peerreviewyes
dc.source.beginpageN03.10
dc.source.conferenceMaterials and Processes for Advanced Interconnects for Microelectronics
dc.source.conferencedate24/03/2008
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMRS Symposium Proceedings; Vol. 1079E


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