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Medium and atmospheric pressure plasma treatment for improvement of adhesion of PDMS used for flexible and stretchable electronics

dc.contributor.authorDe Geyter, N.
dc.contributor.authorMorent, R.
dc.contributor.authorAxisa, Fabrice
dc.contributor.authorDe Smet, N.
dc.contributor.authorGengembre, L.
dc.contributor.authorDe Leersnyder, E.
dc.contributor.authorLeys, C.
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorRymarczyk-Marchal, M.
dc.contributor.authorSchacht, E.
dc.contributor.authorPayen, E.
dc.date.accessioned2021-10-17T06:44:18Z
dc.date.available2021-10-17T06:44:18Z
dc.date.issued2008-08
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13602
dc.sourceIIOimport
dc.titleMedium and atmospheric pressure plasma treatment for improvement of adhesion of PDMS used for flexible and stretchable electronics
dc.typeProceedings paper
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference7th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
dc.source.conferencedate17/09/2008
dc.source.conferencelocationGarmisch-Partenkirchen Germany
imec.availabilityPublished - open access


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