dc.contributor.author | Duval, Fabrice | |
dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
dc.contributor.author | Swinnen, Bart | |
dc.contributor.author | Soussan, Philippe | |
dc.date.accessioned | 2021-10-17T06:58:57Z | |
dc.date.available | 2021-10-17T06:58:57Z | |
dc.date.issued | 2008 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13686 | |
dc.source | IIOimport | |
dc.title | Polymer deep trench filling for Through Silicon Via technology | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Duval, Fabrice | |
dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
dc.contributor.imecauthor | Swinnen, Bart | |
dc.contributor.imecauthor | Soussan, Philippe | |
dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.conference | 13th Meeting of the Symposium on Polymers for Microelectronics | |
dc.source.conferencedate | 7/05/2008 | |
dc.source.conferencelocation | Wilmington, DE USA | |
imec.availability | Published - open access | |