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Polymer deep trench filling for Through Silicon Via technology

dc.contributor.authorDuval, Fabrice
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorSwinnen, Bart
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-17T06:58:57Z
dc.date.available2021-10-17T06:58:57Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13686
dc.sourceIIOimport
dc.titlePolymer deep trench filling for Through Silicon Via technology
dc.typeMeeting abstract
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference13th Meeting of the Symposium on Polymers for Microelectronics
dc.source.conferencedate7/05/2008
dc.source.conferencelocationWilmington, DE USA
imec.availabilityPublished - open access


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