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Controlling scratching in Cu Cchemical-mechanical planarization (CuCMP)

dc.contributor.authorEusner, Thor
dc.contributor.authorSaka, N.
dc.contributor.authorChun, J-H
dc.contributor.authorArmini, Silvia
dc.contributor.authorMoinpour, M.
dc.contributor.authorFisher, P.
dc.date.accessioned2021-10-17T07:03:13Z
dc.date.available2021-10-17T07:03:13Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13708
dc.sourceIIOimport
dc.titleControlling scratching in Cu Cchemical-mechanical planarization (CuCMP)
dc.typeMeeting abstract
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewno
dc.source.beginpage2064
dc.source.conference214th ECS Meeting
dc.source.conferencedate12/10/2008
dc.source.conferencelocationHonoloulu, HI USA
dc.identifier.urlhttp://www.electrochem.org/meetings/biannual/214/214.htm
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts; Vol. MA 2008-02


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