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Multiple chip integration for flat flexible electronics

dc.contributor.authorGovaerts, Jonathan
dc.contributor.authorChristiaens, Wim
dc.contributor.authorBosman, Erwin
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-17T07:22:25Z
dc.date.available2021-10-17T07:22:25Z
dc.date.issued2008-08
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13798
dc.sourceIIOimport
dc.titleMultiple chip integration for flat flexible electronics
dc.typeProceedings paper
dc.contributor.imecauthorGovaerts, Jonathan
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecGovaerts, Jonathan::0000-0002-8908-1198
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceProceedings of the 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic)
dc.source.conferencedate17/08/2008
dc.source.conferencelocationGarmisch-Partenkirchen Germany
imec.availabilityPublished - open access


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