dc.contributor.author | Grasser, Tibor | |
dc.contributor.author | Goes, Wolfgang | |
dc.contributor.author | Kaczer, Ben | |
dc.date.accessioned | 2021-10-17T07:24:20Z | |
dc.date.available | 2021-10-17T07:24:20Z | |
dc.date.issued | 2008-09 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13807 | |
dc.source | IIOimport | |
dc.title | Modeling bias temperature instability during stress and recovery | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Kaczer, Ben | |
dc.contributor.orcidimec | Kaczer, Ben::0000-0002-1484-4007 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 65 | |
dc.source.endpage | 68 | |
dc.source.conference | International Conference on Simulation of Semiconductor Processes and Devices - SISPAD | |
dc.source.conferencedate | 9/09/2008 | |
dc.source.conferencelocation | Hakone Japan | |
imec.availability | Published - imec | |