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Stackable memory of 3D chip integration for mobile applications

dc.contributor.authorGu, S.Q.
dc.contributor.authorMarchal, Pol
dc.contributor.authorFacchini, Marco
dc.contributor.authorWang, F.
dc.contributor.authorSuh, M.
dc.contributor.authorLisk, D.
dc.contributor.authorNowak, M.
dc.date.accessioned2021-10-17T07:27:33Z
dc.date.available2021-10-17T07:27:33Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13821
dc.sourceIIOimport
dc.titleStackable memory of 3D chip integration for mobile applications
dc.typeProceedings paper
dc.source.peerreviewno
dc.source.beginpage813
dc.source.endpage816
dc.source.conferenceIEEE International Electron Devices Meeting - IEDM
dc.source.conferencedate15/12/2008
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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