Publication:
Silicone for flexible packaging of thin dies (<20 μm) using wafer level techniques
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1944 since deposited on 2021-10-17
3last month
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Acq. date: 2025-12-10
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Views
1944 since deposited on 2021-10-17
3last month
2last week
Acq. date: 2025-12-10
Citations