Technology platform for 3-D stacking of thinned embedded dies

Thumbnail
View/open
Metadata
Show full item record
Authors
Iker, Francois; Soussan, Philippe; Beyne, Eric; Baert, Kris
Conference
58th Electronic Components abd Technology Conference - ECTC
Title
Technology platform for 3-D stacking of thinned embedded dies
Publication type
Proceedings paper
Embargo date
9999-12-31
Collections