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Optimization of die pick and place using BCB for 3D stacking

dc.contributor.authorJourdain, Anne
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T07:54:36Z
dc.date.available2021-10-17T07:54:36Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13931
dc.sourceIIOimport
dc.titleOptimization of die pick and place using BCB for 3D stacking
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference13th Meeting of the Symposium on Polymers for Microelectronics
dc.source.conferencedate7/05/2008
dc.source.conferencelocationWilmington, DE USA
imec.availabilityPublished - imec


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