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Chemical and structural modifications in a 193-nm photoresist after low-k dry etch

dc.contributor.authorKesters, Els
dc.contributor.authorClaes, Martine
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorLux, Marcel
dc.contributor.authorFranquet, Alexis
dc.contributor.authorVereecke, Guy
dc.contributor.authorMertens, Paul
dc.contributor.authorFrank, Martin M.
dc.contributor.authorCarleer, Robert
dc.contributor.authorAdriaensens, Peter
dc.contributor.authorBiebuyck, J.J.
dc.contributor.authorBebelman, Sabine
dc.date.accessioned2021-10-17T07:58:53Z
dc.date.available2021-10-17T07:58:53Z
dc.date.issued2008
dc.identifier.issn0040-6090
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13947
dc.sourceIIOimport
dc.titleChemical and structural modifications in a 193-nm photoresist after low-k dry etch
dc.typeJournal article
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorAdriaensens, Peter
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewyes
dc.source.beginpage3454
dc.source.endpage3459
dc.source.journalThin Solid Films
dc.source.issue11
dc.source.volume516
imec.availabilityPublished - imec


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